Background
Since 1961, Chomerics has been a leader in the development of electrically conductive elastomers for use as extruded, molded and form-in-place EMI gaskets for telecommunications and electronics applications. Chomerics also offers an extensive family of thermal interface materials, which transfer heat from electronic components to heat sinks. Careful management of thermal interfaces is crucial to maintaining the reliability and extending the life of electronic devices and equipment. As each new electronic product generation requires higher power in smaller packages, the challenges associated with thermal management become more intense.
Thermal material drivers include:
- Lower thermal impedance
- Higher thermal conductivity
- Greater compliance and conformability
- High reliability
- Greater adhesion
- Ease of handling, application and use
- Long service life