Thermal Interface Materials (TIMs) are used to facilitate heat dissipation in a variety of applications, including printed circuit boards (PCBs).
Zatkoff identified that one of its customers, a PCB manufacturer, was using a thermal pad to facilitate heat dissipation. The manually-assembled thermal pad was being placed between the IC case and the heat sink components. It was also verified that the current thermal pad was not providing enough thermal conductivity, prohibiting necessary heat conduction out of the PCB system and ultimately causing premature failure.
Zatkoff solved its customer’s problem by recommending the Parker Chomerics THERM-A-GAP™ GEL 30 and dispensing it through a fully-automated system. This thermal interface material is easily dispensable, eliminates time-consuming manual assembly, and provides low thermal impedance and high thermal conductivity. It’s also fully cured, which prevents pump out and has ultra-low compression force. These characteristics provided a more efficient heat dissipation, secured the integrity of the PCB components, and reduced the customer’s labor costs through assembly automation. Not to mention, the material has proven long-term reliability, saving time and money on maintenance.
Below is the full list of THERM-A-GAP™ gel and putty products, including the thermal conductivity of each, according to ASTM D5470.
| THERM-A-GAP™ T630 | 0.7 W/m-K |
| THERM-A-GAP™ GEL 8010 | 3.0 W/m-K |
| THERM-A-GAP™ GEL 30 | 3.5 W/m-K |
| THERM-A-GAP™ GEL 45 | 4.5 W/m-K |
| THERM-A-GAP™ TC50 | 5.0 W/m-K |
Zatkoff Seals & Packings carries the entire Parker Chomerics product line for applications that require thermal management and EMI shielding. The knowledgeable and experienced staff helps customers identify problem areas in various applications and determine the best solution with the lowest total cost of ownership.